Semiconductor Production Epuipment Parts Machining Solutions
Japanese manufacturers account for more than 30% of the global market for semiconductor production equipment used to manufacture semiconductors, and demand is also expanding in Taiwan, South Korea, and China.
SPEEDIO is a #30 machining center suitable for aluminum processing of semiconductor production equipment parts, multi-tasking machine, and process integration.
・Energy saving performance achieved by optimal design
・Compactness, space saving, and superior cost effectiveness
Ample travels and table size (W1000Xd2)
The travel of 1000 x 500 mm and the maximum loading capacity of 400kg allows large workpieces or multiple jigs to be mounted, which was not available on the conventional #30 machining center.
Max. 2.4G Z-axis acceleration (W1000Xd2)
With a highly efficient motor and optimized motor control, the machine demonstrates top-class high-speed performance in peck-drilling small holes..
*Peck drilling is a machining method that forcibly divides chips while feeding in steps. The non-cutting time is long due to many steps during machining. W1000Xd1 can reduces the cycle time by Z-axis higher acceleration.
Semiconductor Production Epuipment Parts and Features of SPEEDIO
Parts |
SCompact Machining Center
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W Wide Travel Compact Machining Center
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U Universal Compact Machining Center
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R Pallet Changing Compact Machining Center
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F High Rigidity
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M Compact Multi-tasking Machining
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S300Xd1 | S500Xd1 | S700Xd1 | W1000Xd2 | U500Xd1 | R450Xd1 | R650Xd1 | F600X1 | M200Xd1 | M300Xd1 | |
Large-diameter plateAluminum alloy |
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Aluminum caseAluminum alloy |
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Transfer equipment partsAluminum alloy |
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Transfer equipment partsAluminum alloy |
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Transfer equipment partsAluminum alloy |
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L-shaped bracketSUS316L |
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PlateSUS316L |
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Support BracketSUS316L |
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Feeder FrameAluminum alloy |
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IC test socketsAluminum alloy |
Parts
Machining Center
Large-diameter plate
Aluminum alloy
⌀600 x 30
Feeder Frame
Aluminum alloy
600 x 250 x 12
IC test sockets
Aluminum alloy
65 x 65 x 6